Semiconductor device for multiple packaging configurations

摘要

A semiconductor device having a bonding pad arrangement adaptable both to a package specification which requires lead terminals only along one longitudinal side of the package and to a specification which requires lead terminals to be arranged on both longitudinal sides of the package. The semiconductor device has a semiconductor substrate, a circuit formed on the semiconductor substrate, first and second groups of bonding pads respectively arranged along a first pair of two opposing sides of the semiconductor substrate, and third and fourth groups of bonding pads respectively arranged along a second pair of two opposing sides of the semiconductor substrate, the bonding pads of the first group being electrically connected to the circuit, each of the bonding pads of the third and fourth groups being employed for the same signal as a corresponding bonding pad of the second group, the bonding pads of the second group and the bonding pads of the third and fourth groups being selectively connectable to the circuit electrically.