| 摘要 |
<p>PURPOSE:To eliminate the curling or bending of an IC card, to also make the IC card strong against heat and to also suppress the replacement of parts to the min. at the time of assembling by a method wherein a module substrate having a plurality of IC elements mounted thereon is fitted in, held to and electrically connected to the opening of a card substrate and both surfaces of the card substrate is shielded by metal covers. CONSTITUTION:Three IC bare chips 2 are mounted on the single surface of a module substrate 1 and six IC bare chips are mounted on both surfaces thereof in total and this module substrate 1 is further loaded with a card substrate 5 made of ceramic. Four apertures 10 are provided to the surface of the substrate 5 and the module substrates 1 are held and mounted to the apertures 10 to load one card substrate 5 with 24 IC bare chips 2 in total. The card substrate 5 loaded with the module substrates is molded by a filler such as an epoxy resin or a silicone resin and metal covers 4 are bonded to both surfaces of the card substrate.</p> |
