| 摘要 |
PURPOSE:To enable any defects of respective wafers to be checked up without fail eliminating the feeding process of monitor substrates to processing parts thereby augmenting the yield of the wafers by a method wherein, after baking process of any coating resist films, an inspecting process to inspect the existence of any dusts on both surface and rear surface of a semiconductor wafer is set up and so forth. CONSTITUTION:The title method is provided with four processes i.e. a coating process to coat the surface of a semiconductor wafer with a resist; a baking process to bake a resist film by the said resist coating process; an inspecting process to check if there is any dust on both surface and rear surface of the semiconductor wafer after finishing the baking process; an exposure process to expose semiconductor wafers judged to be free of dust by the inspecting process. For example, a surface inspecting device 20 to inspect both surface and rear surface of the wafer is provided behind the baking part 5 inside the case body 12 of a resist processor. In such a constitution, only the wafers regarded as acceptable by the inspection using the surface inspecting device 20 are carried to an aligner 7 through an interface 6. |
