| 摘要 |
PURPOSE:To obtain a multilayer wiring board improved in degree of interlaminar electrical design and applicable to a high frequency equipment or an equipment required to be precisely controlled in impedance by a method wherein the multilayer wiring board is provided with one or more inner circuits, and at least two layers out of electrically insulating layers between circuits including the inner circuits are formed of two types of resin different from each other in dielectric constant. CONSTITUTION:The hole of an inner through-hole circuit 61 is filled with a filler 30 of resin, inorganic insulator, or metal. At least two layers out of four electrically insulating layers 2, 3, 4, and 5 interposed between circuits are formed of two types of resin different from each other in dielectric constant. For instance, the electrically insulating layers 2, 3, 4, and 5 are formed of epoxy resin, fluororesin, epoxy resin, and fluororesin respectively (or the insulating layer 2 is formed of polyimide resin of dielectric constant of 2, the layers 3 and 4 are formed of fluororesin whose dielectric constant is 2.6, and the layer 4 is formed of polyimide resin of dielectric constant of 5). |
