| 摘要 |
<p>PURPOSE:To reduce the cost a semiconductor device of this design and thermal resistance by a method wherein nail-type conductor pins are arranged in matrix and fixed onto the electrode of a wiring board by brazing their heads to the board, where the wiring board is formed in such a manner that a wiring layer is provided to a plastic board provided with no through-hole. CONSTITUTION:An opening used for forming a semiconductor chip mounting section is provided to the center of a composite plastic board 2 of glass fiber-epoxy resin, glass fiber-triazine resin, glass fiber-polyimide resin or the like 0.2-0.6mm in thickness penetrating the board 2, a wiring pattern is provided onto the surface of the board 2, and a solder resist film is provided onto the surface of the wiring pattern excluding the conductor pin connecting electrode section and a bonding pad section for the formation of a circuit board. A brazing material formed of a eutectic alloy of 80% Au and 20% Sn is provided onto the surface of the conductor pin connecting electrode, which is fused at a comparatively low temperature of 280-300 deg.C to bond the heads of nail-type conductor pins 1 to the electrode without giving any damage to the circuit board. A metal plate 9 is bonded to the rear side of the circuit board with a bonding agent. At this point, the metal plate 9 is required to be similar to the plastic board 2 in thermal expansion coefficient and excellent in thermal conductivity.</p> |
