| 摘要 |
In an IC packaging structure, ball bonding is performed on patterns (4) on a circuit substrate (1) as first bonding, and ballless bonding is performed on pad electrodes (5) on an IC chip (2) as second bonding. An IC packaging method includes a first step of forming a gold ball electrode (5a) on each of pad electrodes (5) of an IC chip, a second step of ball-bonding one end of a gold wire (6) on each of patterns of a circuit substrate, and a third step of thermally compression-bonding the other end of the gold wire on a corresponding one of the gold ball electrodes formed on the pad electrodes. |
