发明名称 ELECTRONIC EQUIPMENT CASE
摘要 <p>PURPOSE:To obtain a cheap case which is easily processed and lightweight by a method wherein at least synthetic resin is molded into the case, and the case concerned is electromagnetically shielded by a metal layer formed on the surface of the case and a lid. CONSTITUTION:A lid 111 and a case 117 are molded out of plastic material of heat-resistant ABS or the like providing a rounding 100 to the corners of them respectively, and metal layers 130 and 131 are formed on the irreducible minimum part required for electromagnetic shielding as an electromagnetic shielding process. A recess 111d is provided to the periphery of the lid 111 to house a shielding ring 102, and a part of the side wall is formed into a protrusion 111b. A protrusion 111c provided with a recess 111e is provided to the part required to come in electric contact with a logic substrate 103a, and a shielding ring 102a is housed in the recess 111e. A recess 117h into which the protrusion 111d of the lid 111 is fitted is provided to the upside face of the side wall of the case 117, and a part of the side wall is formed into a protrusion 117a which is fitted into the recess 111d of the lid 111. An O-ring 108 is housed in the recess 117h of the case 117. A heat radiating plate 118 is provided to the outside of the case 117 if necessary.</p>
申请公布号 JPH02276296(A) 申请公布日期 1990.11.13
申请号 JP19890096480 申请日期 1989.04.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 ONO HIDEYO;YOSHITAKE KUNITOSHI;TSUNODA NOBUYUKI
分类号 H05K9/00;H04B1/034;H05K5/02;H05K5/06;H05K7/20 主分类号 H05K9/00
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