| 发明名称 |
SUPPORT DE CIRCUIT INTEGRE DE HAUTE DENSITE ET APPAREIL D'ETAMAGE SELECTIF DES CONDUCTEURS DU SUPPORT |
| 摘要 |
The TAB substrate (10) of the very large scale integrated circuit (11) includes an insulating sheet (12) including a window (13) provided with leads (14) overhanging it, a tinned zone (19) in the window to facilitate the operation of outer lead bonding. The lead (14) may be bare or gold-plated. |
| 申请公布号 |
FR2629272(B1) |
申请公布日期 |
1990.11.09 |
| 申请号 |
FR19880003674 |
申请日期 |
1988.03.22 |
| 申请人 |
BULL SA |
发明人 |
CLAUDE BERNEUR;JEAN-PIERRE BOITEAU |
| 分类号 |
H01L21/60;H01L21/48;H01L23/495;(IPC1-7):H01L23/12;H01L21/58 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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