发明名称 MULTILAYER PRINTED CIRCUIT BOARD
摘要 PURPOSE:To prevent burr from generating and to improve reliability of electric connection by forming front and rear pads having inner layer through holes or front and rear wirings at the hole as a starting point. CONSTITUTION:Circular front surface pad 1 and rear surface pad 2 are formed at points A, B as centers on forming part of a through hole 7 on the main surface of both-side printed circuit board 10. Inner layer through holes 3 electrically connected to the pads 1, 2 are formed at points A', B' near the pads 1, 2. In this case, the position of the hole 3 is deviated from the position of the through hole, and the pads 1, 2 and the hole 3 are formed in a 8 shape. Thus, the pad 1 is electrically connected to the pad 2 via the hole 3. Thus, it can prevent burr to improve an electric connection.
申请公布号 JPH02275695(A) 申请公布日期 1990.11.09
申请号 JP19890097980 申请日期 1989.04.17
申请人 NEC CORP 发明人 KOBAYASHI KENJI
分类号 H05K3/46 主分类号 H05K3/46
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