| 摘要 |
<p>PURPOSE:To prevent crack failures of a finger caused by thermal stress after a semiconductor device is mounted on a substrate, by sealing the semiconductor device with a first sealing resin layer and a second sealing resin layer, which first layer is formed of mold resin containing 30-80% solvent and has a thickness approximate to finger thickness, and which second layer is composed of mold resin containing filler. CONSTITUTION:On the functional surface of a semiconductor chip 6, mold resin containing 30-80% solvent is spread and dried, thereby forming a first sealing resin layer 30 having a thickness approximate to the finger 3 of a semiconductor device D. After that, a semiconductor device D is attached on a substrate on which a conducting pattern 21 is formed, in the manner in which a first sealing resin layer 30 faces the substrate; mold resin containing filler is spread on the periphery of the semiconductor device D attached on the substrate; a second sealing resin layer 31 is formed by drying; thus the semiconductor device D on the substrate is sealed. Thereby, when thermal stress generates, it is applied to the whole part of the finger and dispersed, so that cracks and cutting of the finger can be reduced.</p> |
