SEMICONDUCTOR ELEMENT PACKAGE

摘要

PURPOSE:To obtain a semiconductor package by placing a semiconductor element on a substrate mainly composed of thermoplastic resin to be resin-sealed by transfer molding. CONSTITUTION:A semiconductor 4 is placed on a thermoplastic resin substrate 3 having a wiring pin 1 and a wiring foil 2 for being connected to an electric wire. A resin coating 6 is performed by transfer molding. Projections 7 are for positioning at the time of handling of a package. Thermoplastic resin for the substrate is desirable to contain especially above 90% of a prescribed repeated unit of polyphenylene sulfide in view of adhesiveness and heat resistance. Sealing resin for transfer molding is especially desirable to be epoxy resin for semiconductor sealing. By this constitution, a semiconductor element package having high moisture resistant reliability can be simply and economically manufactured.