发明名称 HEAT-SINK STRUCTURES WITH INCREASED HEAT DISSIPATION CAPACITY AND METHODS FOR THE PRODUCTION OF SUCH STRUCTURES
摘要 A porous or non-woven structure of high thermally conductive ceramic particles is embedded in a matrix of thermally conductive ceramics to provide a heat-sink substrate. Particular application to AlN heat-sinks. Embedding is provided by infiltration by dense ceramics under CVD conditions. In an embodiment the particles are whiskers coated with a diamond layer.
申请公布号 WO9012769(A2) 申请公布日期 1990.11.01
申请号 WO1990EP00731 申请日期 1990.04.26
申请人 BATTELLE MEMORIAL INSTITUTE 发明人 SCHACHNER, HERBERT;RICHON, DOMINIQUE;ISSARTEL, JEAN-PAUL;TIPPMANN, HEINZ;HORLAVILLE, GERARD
分类号 C04B35/571;C04B35/581;C04B35/80;H01L21/48;H01L23/373 主分类号 C04B35/571
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