发明名称 |
HEAT-SINK STRUCTURES WITH INCREASED HEAT DISSIPATION CAPACITY AND METHODS FOR THE PRODUCTION OF SUCH STRUCTURES |
摘要 |
A porous or non-woven structure of high thermally conductive ceramic particles is embedded in a matrix of thermally conductive ceramics to provide a heat-sink substrate. Particular application to AlN heat-sinks. Embedding is provided by infiltration by dense ceramics under CVD conditions. In an embodiment the particles are whiskers coated with a diamond layer. |
申请公布号 |
WO9012769(A2) |
申请公布日期 |
1990.11.01 |
申请号 |
WO1990EP00731 |
申请日期 |
1990.04.26 |
申请人 |
BATTELLE MEMORIAL INSTITUTE |
发明人 |
SCHACHNER, HERBERT;RICHON, DOMINIQUE;ISSARTEL, JEAN-PAUL;TIPPMANN, HEINZ;HORLAVILLE, GERARD |
分类号 |
C04B35/571;C04B35/581;C04B35/80;H01L21/48;H01L23/373 |
主分类号 |
C04B35/571 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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