| 摘要 |
<p>The invention is to form an intrinsic base layer (16) by doping an impurity in the emitter polysilicon electrode (15) into the intrinsic base region (16) of the surface of a semiconductor substrate (1) by heat treatment through the emitter lead-out part hole (14) self-aligned to the base lead-out electrode (7). Thus, beneath the insulation film of the substrate surface between the base lead-out part hole and emitter lead-out part hole (14), the outer marginal part of the intrinsic base layer (16) and the inner marginal part of the extrinsic base layer (11) overlap uniformly. Still more, since the diffusion of the impurity by heat treatment is very fast in the polysilicon emitter electrode as compared with that in the silicon substrate, an extremely shallow intrinsic base layer (16) may be formed.</p> |
