| 摘要 |
PURPOSE:To improve the bonding efficiency eliminating restriction on the circuit pattern by arranging a bonding pad on the post side in such a manner as to extend in both directions of X and Y with respect to the mount pad for pallets or wrap therearound. CONSTITUTION:Bonding pads 12 and 16 on the post side are so arranged as to extend in both directions X and Y with respect to the mount pads 11 and 15 for junction of LED pellets or wrap therearound. With such an arrangement, any kind of bonding can be done without turning the bonding stage even in the case of using an ultrasonic bonder. This can eliminates restriction on the designing of the circuit pattern while improving the bonding efficiency with the ultrasonic bonder. |
