| 摘要 |
<p>PURPOSE:To facilitate the positioning outer electrode terminals, and further to reduce the number of assembly steps by a method wherein a metallic base plate with semiconductor chips soldered is fitted to a case with outer terminal inserted from below, both of which are then sealed with resin. CONSTITUTION:Prints of solder plates with cryogenic flux or cryogenic cream solder are mounted and flowed to a hot plate or a reflow furnace, resulting in soldering. Thereafter, an outer electrode inserted case 18 is coated with an adhesive an adhesive at the part corresponding to the periphery of a metallic base plate 1, a cryogenic cream solder is applied to the tips of outer electrode terminals 10-14 by using a dispenser. The soldering of the outer electrodes and the adhesion of the case are carried out by putting the case over the assembled components and leaving the whole on the hot plate for several minutes. Afterwards, the gel is cast through a gel casting port 19 with the dispenser and cured. Next, epoxy resin is cast with the dispenser and cured.</p> |
