| 摘要 |
In an IC carrier for carrying thereon an IC package so as to facilitate the IC package to be transferred, a contact insertion space opening up in an inserting direction of a contact of an IC socket, etc. is provided between a frame for forming a supporting seat of an IC contact piece projecting sideward of the IC package and the IC contact piece, so that the contact inserted into the contact insertion space presses the IC contact piece to realize a contacted state.
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