| 摘要 |
A thin-film forming device has a support frame for supporting a substrate to be coated with a thin film, a reaction chamber having a space surrounded by the substrate supported on the support frame, side walls mounted under both sides of the substrate and a bottom wall mounted under the side walls, an atomizer for delivering an atomized solution of a material to be coated on the surface of the substrate, a heater disposed behind the substrate for heating the substrate to a temperature higher than a reaction temperature of the material, and a nozzle connected to the atomizer and disposed in the reaction chamber in facing relation to the substrate for spraying the atomized solution toward the surface of the substrate, and cooling means for cooling at least an inside portion of the bottom wall in facing relation to the substrate to a temperature below the reaction temperature of the material. |
