| 摘要 |
PURPOSE:To preserve the rear face of a semiconductor substrate by a method wherein an adhesive tape is pasted on the rear of the semiconductor substrate, a chemical liquid or a processing agent is sprayed on the surface of the substrate, a one-side etching operation or a one-side polishing operation is executed and, after that, the adhesive tape is stripped off. CONSTITUTION:An adhesive tape 2 is constituted of an adhesive 2a and a base material 2b; the adhesive 2a is set according to a chemical liquid 3 used for an etching operation. The selected adhesive tape 2 is pasted on the rear 1b of a semiconductor substrate 1; the chemical liquid is sprayed on the semiconductor substrate 1; a one-side etching operation or a one-side polishing operation is executed. Even when the chemical liquid 3 reaches the rear 1b during this operation, it is possible to restrain a situation that the chemical liquid 3 comes into contact with the rear face 1b because the adhesive 2a with a chemical- resistant stability exists on the rear face 1b. Thereby, the rear face of the semiconductor substrate 1 is preserved.
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