| 摘要 |
A low stress additive system for epoxy encapsulants, and low stress epoxy encapsulants containing the low stress additive system are disclosed. The low stress additive system comprises composite organic polymer particles and liquid silicon-containing compounds, such as organopolysiloxanes. The epoxy encapsulants prepared with the low stress additive system display low stress, good flow, and do not exhibit excess resin bleed. |
