| 摘要 |
<p>PURPOSE:To allow a collet to effectively suck a semiconductor pellet and to prevent mistake of pickup by holding a lifting pin, forming a funnel-like recess on the upper surface, and providing a holder for sucking a wafer sheet. CONSTITUTION:A lifting pin 5 is held, a funnel-like recess is formed on the upper surface, and a holder 3 for sucking a wafer sheet 2 is provided. When the sheet 2 is sucked by the holder 3, the four corners of a semiconductor pellet 1 are brought into contact with the oblique surface of the recess formed on the upper surface of the holder 3 to be held, the sheet 2 is sucked along the inner wall of the recess, and the sheet 2 is peeled from the pellet 1. Then, the pellet 1 is lifted by the pin 5 from the lower surface of the sheet 2, and the pellet 1 is sucked to the collet 4 moved down from above. Thus, the pellet 1 can be easily sucked by the collet 4 to reduce the mistake of pickup of the collet 4.</p> |
