| 摘要 |
PURPOSE:To improve the junction technology by a method wherein the precise junction of respective P side electrodes of LED array chip with respective lead electrodes of a heat sink base is realized by making use of the physical characteristics of the alignment pads. CONSTITUTION:The rear surface of an LED chip 21 and the surface of a heat sink base 31 are opposed to each other so as to heap up respective alignment pads 24a with 33a as well as 24b with 33b making pairs vertically. Then, a brazing alloy in lower melting point than that of P side electrodes 23 and lead electrodes 32 is laid between the pads 24a and 33a and between the pads 24b and 33b. Furthermore, when pads 24a, 24b, 33a, and 33b are heated for melting down, the chip 21 is shifted by the surface tension of the melt to make alignment of an N side electrode 22, the P side electrode 23 and the lead electrodes 32 to be connected to one another. Lather, these electrodes 22, 23 and the lead electrodes 32 are heated for melting down with one another to realize the junction of the chip 21 with the base 31. Through these procedures, the prevention of shorticircuit between electrodes, the restraint of thermal resistance and the alignment with optical fiber can be facilitated. |
