发明名称 MANUFACTURE OF CERAMIC MULTILAYER WIRING BOARD
摘要 PURPOSE:To prevent the generation of pinhole and the like and to obtain a ceramic multilayer wiring board, whose insulation properties are not deteriorated, by a method wherein in case insulating paste layers are stacked on a conductor paste in a multilayer, the viscosities of the paste layers of the second time and succeeding times are made higher than that of the paste layer of the first time. CONSTITUTION:A conductor paste 2 is provided on an alumina ceramics green sheet 1. Then, an insulating paste 3 of the first time is printed excepting an interlayer through hole (a via hole) 5. A conductor paste is filled in the through hole and an insulating layer (an insulating paste) 4 of a viscosity higher than that of the paste 3 is applied on the paste 3 excepting the through hole. After this, the through hole is filled according to the need and an application of insulating pastes of the third time and succeeding times is executed and the insulating pastes are fired at 1600 deg.C to form a multilayer wiring board. In an application of the insulating pastes of a plurality of times, as the viscosities of the pastes are selected in a prescribed relation, there is no generation of pinholes and the deterioration of the electrical characteristics of the board is not generated.
申请公布号 JPH02252297(A) 申请公布日期 1990.10.11
申请号 JP19890071978 申请日期 1989.03.27
申请人 NGK INSULATORS LTD 发明人 MORIMOTO TADAHIKO;ASAI MICHIO
分类号 H05K3/46 主分类号 H05K3/46
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