Adhesive composition based on an unsaturated polyester resin, in particular for SMD components

摘要

The aim of the adhesive composition based on an unsaturated polyester resin and intended in particular for the mounting of electronic components on circuit boards is to achieve improved adhesion by means of an additional component in the form of an oligomer which contains urethane groups and has at least two unsaturated end groups. This oligomer is obtained by reacting a hydroxyl-containing acrylate or methacrylate with a diisocyanate, alone or as a mixture with difunctional alcohols in addition.