VERFAHREN ZUR MONTAGE VON HALBLEITERGERAETEN UND EINRICHTUNG ZU DESSEN DURCHFUEHRUNG

摘要

A wire bond (5) is formed between conductive pads, (1, 2) of a case (3) and a crystal (4) of a semiconductor device. Bonding is performed by joining a wire by means of an ultrasonic bonding tool (6) to the conductive pad (1), followed by pulling the wire through the bonding tool (6) and joining it to the conductive pad (2). The pulling is performed along a path that determines the shape of the wire bond (5), by forming a portion (7) ascending for the conductive pad (1), while the bonding tool (6) and an XY table (11, Fig. 2) carrying the semiconductor device move relative to each other, a plastically deformed flexure point (8) at which the wire is fixed in position by an operative member (33, Fig.2) of a wire fixing unit (32), and a portion (9) descending to the conductive pad (2) formed by moving the bonding tool (6) down, while the operative member (33) is kept stationary with respect to the semiconductor device. A non-destructive testing unit (72, Fig.2) applies a stretch-out force (P) to the wire for testing the strength of the wire bond.