发明名称 WIRE BONDER AND FORMATION OF BUMP BY USING THE WIRE BONDER
摘要 PURPOSE:To form a bump easily and surely by a method wherein a ball formed at a wire drawing-out port of a capillary is pressed onto an electrode pad, melted and bonded, a wire continued from the ball is torn off when the capillary is moved, the bell is pressed to a flat face provided on the tip of the capillary and its shape is adjusted. CONSTITUTION:The tip of a capillary 1 is formed to be a shape provided with a flat face 4. A ball 10 is formed at a wire drawing-out port of the capillary 1, pressed onto an electrode pad 6, melted and bonded, after that, the capillary 1 is translated in parallel up to a second bonding position; a wire continued from the ball 10 is torn off; the capillary 1 is made to execute a second bonding operation. In this manner, the ball 10 is pressed onto the flat face 4 at the tip of the capillary 1; its shape is adjusted; a bump is formed. Thereby, the bump can be formed simply without a need for an apparatus or a utensil for wire cutting use, and can be bonded surely onto the electrode pad.
申请公布号 JPH02250328(A) 申请公布日期 1990.10.08
申请号 JP19890070566 申请日期 1989.03.24
申请人 TOSHIBA CORP 发明人 SAITO KAZUYOSHI
分类号 H01L21/60;H01L21/321 主分类号 H01L21/60
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