发明名称 METHOD AND APPARATUS FOR CUTTING AND SEPARATING ELECTRONIC ELEMENT
摘要 <p>PURPOSE:To reduce the pellet rising phenomenon during the incorporating period of an electronic element and improve the yield by slanting in parallel two faced cut surfaces so as to form a parallelogram, and providing slants toward an electrode surface on the two cut surfaces so that the two cut surfaces become at least a trapezoid or reversed trapezoid. CONSTITUTION:All (e2, f2, g2, and h2) of four cut surfaces of a chip are cut in parallel to have the same slant angle theta, and all of the four cut surfaces are made into a parallelogram. Since the slants are provided on the cut surfaces, in the case where the cut surfaces drop in a sealed glass material in an up-and- down state of the cut surfaces, a reverse moment proportional to the side length and slant angle actuates thereto, and thus, an electronic element is reversed at 90 deg., and stands in an up-and-down state of the electrode surfaces. Whereby the pellet rising phenomenon is reduced, and the yield can be improved.</p>
申请公布号 JPH02249611(A) 申请公布日期 1990.10.05
申请号 JP19890070645 申请日期 1989.03.24
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 YAMADA YOSHIAKI;KOBAYASHI KOZO
分类号 B28D5/00;H01L21/301;H01L21/78 主分类号 B28D5/00
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