| 摘要 |
<p>A bonding material includes a sheet base material having a shielding property, a first heat-bondable resin layer formed on one of the main planes of the sheet base material and having low bonding power and a second heat-bondable resin layer formed at part of the surface of the first heat-bondable resin layer and having high bonding power. The bonding material includes also the sheet base material, a shielding layer formed on one of the main planes of the sheet base material and having a shielding property, a first heat-bondable resin layer formed on the surface of the shielding layer and having low bonding power and a second heat-bondable resin layer formed at part of the surface of the first heat-bondable resin layer and having high bonding power. Accordingly, the first heat-bondable resin layer is bonded weakly to a member to be bonded and the second heat-bondable resin layer, strongly, when the surfaces of the first and second heat-bondable resin layers are put onto the surface of the member to be bonded and heat is applied to them. Accordingly, the sheet base material will not by any chance peel off from the member to be bonded due to the force acting on the portion where the second heat-bondable resin layer is formed. When the sheet base material or the like is cut and peeled at the portion where the second heat-bondable resin layer is not formed, the first heat-bondable resin layer is peeled from the member to be bonded along with the sheet base material in the case of a bonding material including the sheet base material having the shielding property, and the shielding layer and the first heat-bondable resin layer are peeled off along with the sheet base material from the member to be bonded in the case of bonding material including the shielding layer having the shielding property. Therefore, the surface of the member to be bonded becomes visible.</p> |
