发明名称 METHOD OF PRODUCING SEMICONDUCTOR DEVICES
摘要 <p>A method of introducing impurities into polycrystalline silicon formed on an insulating film. An As-containing silicate glass layer (13) is formed on a polycrystalline silicon layer (12) formed on an insulating film (2) followed by the heat treatment, in order to introduce arsenic into the polycrystalline silicon layer (12). The silicate glass layer (13) has an arsenic concentration of greater than 25 % by weight in terms of As2O3, and the heat treatment is carried out in a mixture gas atmosphere of N2 and O2 having an oxygen partial pressure ratio of 0.05 to 0.7 at 1000°C or higher for 60 minutes or longer.</p>
申请公布号 WO1990011618(P1) 申请公布日期 1990.10.04
申请号 JP1990000372 申请日期 1990.03.20
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