发明名称 LASER TRIMMING SYSTEM FOR SEMICONDUCTOR IC CHIP PACKAGE
摘要 PURPOSE: To fully automatically remove debris by providing a first member having a center opening, making a laser beam incident therefrom reach a workpiece located at the other end, and forming a gas flow for the purpose of discharging the debris, which are generated from the machining operation by the laser beam, out of the other end of the center opening. CONSTITUTION: The position of damnbars on a package 10 is searched and found by a machine vision system 38, and the information is supplied to a processor 42. The action of a laser 32 and a galvanometer-mirror 36 are controlled by the processor, and the damnbars are trimmed from the package 10. A defocusing lens 54 is moved into the route of the laser beam 34, with the intensity attenuated. Using this low intensity laser beam, flashes 18, 20 of plastics are removed from the package. The smoke and debris generating in this trimming operation are removed by a vacuum system mounted on an installation tool 46. After the end of the trimming, the parts are dismantled from the installation tool and removed from the work station through an index operation.
申请公布号 JPH02247090(A) 申请公布日期 1990.10.02
申请号 JP19900042705 申请日期 1990.02.26
申请人 NATL SEMICONDUCTOR CORP <NS> 发明人 MAIKERU EIRUBU MIRAAITSUKU;MAIKERU UIRIAMU PATAASON
分类号 B23K26/00;B23K26/03;B23K26/06;B23K26/14;H01L21/00;H01L21/48;H01L23/50;H01S3/00 主分类号 B23K26/00
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