| 摘要 |
A capacitive structure, in which thermal stresses tending to delaminate its capacitive layers tend to be substantially relieved before such layers delaminate. The capacitive structure is divided into an upper substructure and a lower substructure, each comprising a plurality of capacitive layers, a separating layer being sandwiched between such substructures. The upper substructure comprises an underlying layer of dielectric material. The lower substructure comprises an overlying layer of dielectric material. The separating layer is provided by spraying a colloidal suspension of polytetrafluoroethylene in a liquid carrier containing a suitable binder onto one surface of one of such overlying and underlying layers. The separating layer bonds less aggressively to at least one of the substructures than the substructures would bond to each other if the separating layer were omitted. |
