Surface-mounted multilayer capacitor and printed circuit board having such a multilayer capacitor.

摘要

The capacitor of the invention comprises a multilayer of electrodes (12) and dielectric layers which are alternately stacked. The end contacts of the electrodes consist of a thin metal-sprayed layer (14, 15) and a U-shaped cap (16) which engages the capacitor in a clamping manner. The metal-sprayed layer (14, 15) and the cap (16) can contact each other electrically via a solder layer (17). Preferably, the metal-sprayed layer (14,15) is impregnated with a thermocuring synthetic resin and said synthetic resin is cleared from a part of said layer. The capacitor preferably comprises coating layers (13) which are cemented to the multilayer by means of an adhesive layer.