| 发明名称 |
Process for reflow soldering. |
| 摘要 |
<p>A method of joining components to a substrate by reflow soldering with non-rosin-based flux containing solder, comprising heating the solder in the presence of the components in a low oxidizing atmosphere.</p> |
| 申请公布号 |
EP0389218(A1) |
申请公布日期 |
1990.09.26 |
| 申请号 |
EP19900302926 |
申请日期 |
1990.03.19 |
| 申请人 |
THE BOC GROUP, INC. |
发明人 |
BANDYOPADHYAY, NIKHILES;KIRSCHNER, MARK J. |
| 分类号 |
B23K1/19;B23K31/02;B23K35/22;B23K35/363;B23K35/38;B23K101/42;H05K3/34 |
主分类号 |
B23K1/19 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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