| 摘要 |
PURPOSE:To alleviate stress concentration by the edge effect of the outer surface end of a substrate supporting part and to control the occurrence of cracks in resin by rounding the inner and outer edges of a frame, and forming the semi-cylindrical end surfaces. CONSTITUTION:An outer edge 1a and an inner edge 2a of a substrate supporting part 1 and a lead terminal part 2 which constitute a lead frame are rounded in a semi-cylindrical shape by etching. In this structure, even if residual tensile stress is generated in a resin 4 due to the difference in thermal expansion coefficients in a resin sealed type semiconductor device, stress concentration due to edge effect is controlled because the outer surface end 1a and the inner surface end 2a are not in acute angle. Thus, the occurrence of cracks can be suppressed. |
