发明名称 JET TYPE SOLDER TANK
摘要 PURPOSE:To solder surely without omission by installing plural nozzles in the body of a tank, and providing spiral current plates in the nozzles and thereby infiltrating molten solder ino details of the part. CONSTITUTION:When pump blades are rotated by a motor, molten solder is circulated and sent to a cylindrical nozzle 12 by pressure and raised in the nozzle 12. At this time, vortical vector is given to the molten solder by a spiral current plate 24 in the nozzle 12 and jetted from an opening 21 at the upper end of the nozzle 12. At the same time, it flows out to the side of a curved plate 15 and to the side of a concavity 16. When a printed circuit substrate 32 to which a leadless part 31 is adhered on the lower face is advanced at an upward inclination angle of alpha to the jet wave, the part 31 is subjeted to pressure from all angles, and the molten solder infiltrates into details of the part 31, and thus satisfactory soldering can be obtained.
申请公布号 JPS5813470(A) 申请公布日期 1983.01.25
申请号 JP19810111286 申请日期 1981.07.16
申请人 TAMURA SEISAKUSHO:KK 发明人 MASUDA TSUGUNORI;TAKAHASHI HIDEAKI
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
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