发明名称 Method of arranging components in semiconductor device.
摘要 <p>A method of arranging components in a semiconductor device on a substrate (11), comprising provisionally determining a wiring path (3) so that a predetermined wiring capacitance is not exceeded in a specific network (1) and then performing a wiring process of elements (12) in the specific network within a component placement region (2) determined by the wiring path.</p>
申请公布号 EP0388189(A2) 申请公布日期 1990.09.19
申请号 EP19900302746 申请日期 1990.03.15
申请人 FUJITSU LIMITED;FUJITSU VLSI LIMITED 发明人 NISHIOKA, SEISHI;OKADA, ATSUHIKO
分类号 H01L21/822;G06F17/50;H01L21/82;H01L27/02;H01L27/04;H01L27/118 主分类号 H01L21/822
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