发明名称 |
Method of arranging components in semiconductor device. |
摘要 |
<p>A method of arranging components in a semiconductor device on a substrate (11), comprising provisionally determining a wiring path (3) so that a predetermined wiring capacitance is not exceeded in a specific network (1) and then performing a wiring process of elements (12) in the specific network within a component placement region (2) determined by the wiring path.</p> |
申请公布号 |
EP0388189(A2) |
申请公布日期 |
1990.09.19 |
申请号 |
EP19900302746 |
申请日期 |
1990.03.15 |
申请人 |
FUJITSU LIMITED;FUJITSU VLSI LIMITED |
发明人 |
NISHIOKA, SEISHI;OKADA, ATSUHIKO |
分类号 |
H01L21/822;G06F17/50;H01L21/82;H01L27/02;H01L27/04;H01L27/118 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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