Ceramic lid for sealing semiconductor element and method of sealing a semiconductor element in a ceramic package.

摘要

A ceramic lid (1) for sealing a semiconductor element and has a sealing surface for forming a seal with a ceramic package (6) housing a semiconductor (7) within a recess. A glass sealant is heated and hermetically seals said semiconductor element. The ceramic lid (1) is made of alumina of high purity and a glass sealing aid is applied to the sealing surface and is pretreated at a higher temperature than the heating temperature for sealing said semiconductor element, before the hermetic sealing of the semiconductor element in the ceramic package. This improves the strength of the seal and allows a smaller seal area.