| 摘要 |
PURPOSE:To improve the degree of integration and characteristics such as noise reduction by mounting other semiconductor element on a semiconductor element. CONSTITUTION:An IC connection element 1 is mounted on an IC chip 16, connected with an Al upper layer 4 by an IC connection part 2, via a bump structure 3, and connected with an internal circuit from an Al lower layer. Thereby, the degree of integration is improved, and characteristics such as noise reduction can be improved. |
