KLEBSTOFF

摘要

So far, contact or fusion adhesives have been used to make temporary bonds. However, high temperatures or considerable mechanical force are required to release the materials and it is often impossible to prevent damage to fragile materials. The new adhesive is intended for use in the same fields as contact and fusion adhesives and also as a reaction adhesive and is designed to be transformed into a state of low viscosity for the release of the secured material. Instead of polymeric materials, the novel adhesive contains a low-molecular component with liquid-crystal properties which, through the conversion from a low-viscosity to a liquid-crystal phase of higher viscosity, produces a bond between the materials. The adhesive is suitable for the temporary or permanent securing of semiconductor components, wafers or components to be thermally or mechanically processed.