发明名称 |
HANDASETSUGOHOHO |
摘要 |
An integrated circuit chip is joined to a substrate by first applying solder to the substrate and/or the IC chip, and then applying diol and /or polyol and/or ether derivatives thereof to the substrate. The IC chip is placed in contact with the applied diol/polyol and the resulting assembly is heated in a reducing atmosphere. This process avoids the application of liquid flux compositions and the necessity to remove the flux or flux residues in separate cleaning steps. |
申请公布号 |
JPH0240423(B2) |
申请公布日期 |
1990.09.11 |
申请号 |
JP19860158133 |
申请日期 |
1986.07.07 |
申请人 |
INTAANASHONARU BIJINESU MASHIINZU CORP |
发明人 |
URASUTA AGUNESU BURUSHITSUKU;PIITAA JAARU ERUMUGUREN;CHAARUZU JEEMUSU OOEN;DEEBITSUDO UIRIAMU SHISENSUTAIN JUNIA;HEREN RI IEE |
分类号 |
B23K1/00;B23K1/008;B23K35/36;B23K35/38;B23K101/42;H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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