| 摘要 |
<p>PURPOSE:To prevent a wafer carrier from being mis-recognized and the occurrence of dust by a method wherein a bar code serving as a recognition medium of the wafer carrier is buried inside the transparent or semi-transparent wafer carrier material in such a manner that it can be read from outside. CONSTITUTION:Bar codes 2 and 4 serving as a wafer carrier recognizing medium used for recognizing a wafer carrier are buried inside a transparent or semi-transparent wafer carrier material used for the manufacture of a semiconductor in such a manner that they can be read from outside. For instance, the wafer carrier recognizing bar codes 2 and 4 are buried in the front of wafer carrier main bodies 1 and 3 formed of transparent or semi-transparent material in such a manner that they can be read from the upside of the wafer carrier main body 1. By this setup, both the mis-recognition of a wafer carrier due to the separation, the cutoff, and the abrasion of a wafer carrier recognizing bar code and the occurrence of dust can be prevented.</p> |
