| 摘要 |
<p>A fluid flow control for use with a process chamber (22,22 min ). In the disclosed embodiment, the process chamber is for ion implantation of a workpiece and the fluid flow control is to assure the flow rates are maintained at values which are efficient in evacuating and pressurizing the chamber but are not high enough to dislodge particulate contaminants from the process chamber walls. In the disclosed design, the invention has utility both in instances in which wafers are directly inserted into the process chamber (22 min ) for ion implantation and in which the wafers are inserted into the chamber by use of a load-lock (72) which avoids the requirement that the process chamber be cyclically pressurized and depressurized.</p> |
