| 摘要 |
PURPOSE:To make it possible to prevent the generation of the flushed burrs of a resin constituting a box type resin molding body on a lead frame constituting a semiconductor device by a method wherein a protruding part for forming the hollow part of the box type resin molding body is made to protrude from a parting face and the scheduled contact surfaces of the lead frame with inner leads at the protruding part are formed into a tapered form and the like. CONSTITUTION:In molding dies 3a and 3b which are used at the time of manufacture of a box type resin molding body with a lead frame constituting a semiconductor device, a protruding part 4, which is used for forming the hollow part of the molding body, of the dies 3a and 3b is made to protrude from a parting face 5, the scheduled contact surface of the lead frame 2 with an island 2a at the part 4 is formed into a surface parallel to the face 5 and the scheduled contact parts of the frame 2 with inner leads 2b at the part 4 are provided into a tapered form. For example, a protruding difference between the scheduled contact surface of the lead frame 2 with the island 2a at the part 4 and the face 5 is set in 10 to 100mum. |
