发明名称 |
Heating furnace for semiconductor wafers |
摘要 |
A heating furnace for semiconductor wafers having a heater arranged around a core tube, layers of a heat insulating material made of a porous heat insulating material or ceramic fibers arranged around the heater, and layers of a heat reflecting material arranged in the layers of the heat insulating material.
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申请公布号 |
US4954685(A) |
申请公布日期 |
1990.09.04 |
申请号 |
US19880223343 |
申请日期 |
1988.07.25 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
KUMAGAI, HIROMI;SATO, KAORU;IMAI, YOSHIO |
分类号 |
C30B25/10;C30B31/12;F27D1/00 |
主分类号 |
C30B25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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