发明名称 Heating furnace for semiconductor wafers
摘要 A heating furnace for semiconductor wafers having a heater arranged around a core tube, layers of a heat insulating material made of a porous heat insulating material or ceramic fibers arranged around the heater, and layers of a heat reflecting material arranged in the layers of the heat insulating material.
申请公布号 US4954685(A) 申请公布日期 1990.09.04
申请号 US19880223343 申请日期 1988.07.25
申请人 TOKYO ELECTRON LIMITED 发明人 KUMAGAI, HIROMI;SATO, KAORU;IMAI, YOSHIO
分类号 C30B25/10;C30B31/12;F27D1/00 主分类号 C30B25/10
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