| 摘要 |
<p>PURPOSE:To manufacture a mold easily by a method wherein runners leading to a pot and cavities connecting directly to these runners are provided at the portions at which a top force abuts against a bottom force to remove gates. CONSTITUTION:A plurality of runners 25 extending from the pot 24 are provided on the lower surface of the top force 22 and a plurality of cavities 26 are provided on the upper surface of the bottom force 23 at the positions crossing and opposing against the runners 25. The rear surface of the radiator plate 18 of a lead frame 15 of a semiconductor device 19 is pushed against the lower surface of the top force 22, the runners 25 face each other at the linearly arranged gate portions a of the radiator plate 18 and the mold portion of the lead frames 15 is stored in cavities 26 corresponding to the bottom force 23 to hold the non-mold portions of both radiator plates 18 and lead portions 16 between the top and bottom forces 22, 23. When molten resin is injected from the pot 24, the cavities 26 are filled with molten resin in the runners 25 through the gate portions (a) of the radiator plate 18.</p> |
