| 摘要 |
Polyimide polymers having a relatively low dielectric constant and good solvent resistance, are formed by polymerization of a polyimide oligomer having the formula <IMAGE> <IMAGE> +TR <IMAGE> wherein R is selected from the group consisting of: -C 3BOND CH, -CH=CH2, -CN, and <IMAGE> wherein R1 is -H or -CH3, and n=1-20. Preferably R is an acetylene group. These polymers may also be formed from the corresponding polyamic acid oligomers. These polymers are useful for forming dielectric layers, particularly in multilayer semiconductor devices.
|
