PROCESS AND APPARATUS FOR SEALING SEMICONDUCTOR PACKAGE

摘要

A semiconductor package is formed using two flat thermoplastics mouldings, one or both having a cavity for a chip and lead frame. The frame (1) is held vertically while holding the mouldings (4) initially horizontal in the cavities (5) of two mould parts which are symmetrically adjacent to the frame. The frame and mouldings are heated and the mould parts then rotated through 90 deg. and pressed against the frame to join them integrally to each other and to the frame. The appts. includes a pair of lead frame heaters (7) movable vertically from an inoperable position adjacent the frames, and a pair of hot-air heaters (6) movable vertically to and from the mould parts and moved upwardly away from the mould parts during their rotation. The mouldings are e.g. of polyphenylenesulphide filled with glass fibre.