FLEXIBLE PCB AND MANUFACTURING METHOD THEREOF, PARTICULARLY CONCERNED WITH FORMING PLATING LAYER ON REGIONS ONLY WHERE VIA HOLES ARE FORMED

摘要

PURPOSE: A flexible PCB(Printed Circuit Board) and a manufacturing method thereof are provided to improve the flexibility of the PCB by not forming a plating layer on regions except regions where via holes are formed. CONSTITUTION: A copper film(12) is laminated on a base film(10) to form a first laminated structure. A circuit and a via hole(13) is formed on the first laminated structure to form a second laminated structure. An electrodeless copper plating(14) is performed to form a third laminated structure. An electrolytic plating(15) is performed to form a fourth laminated structure. An etching mask member is laminated on one side of the fourth laminated structure to form a fifth laminated structure. The fifth laminated structure is etched to obtain a sixth laminated structure. The etching mask member is removed from the sixth laminated structure. An upper film(17) is laminated on the sixth laminated structure.