| 摘要 |
PURPOSE:To make it possible to easily change connection correspondence between the input/output terminal of a semiconductor chip and the external lead by connecting projecting conductors, which are provided on the first insulating plate to mount a semiconductor chip, with each others optionally through a recessed conductor and an inner lead, which are provided at a second insulating plate to be overlaid on the first insulating plate, etc. CONSTITUTION:This is made into the one that a second insulating plate 8, which has first and second recessed conductors 9 and 10, which are so formed as to respectively correspond to first and second projecting conductors 5 and 7 and are connected by being set in them, and a buried third inner lead 4c, which connects the first recessed conductor 9 with the second one optionally, is overlaid on a first insulating plate 11, which has a recess, in which a semiconductor chip 1 is mounted, a first inner lead 4a, which is formed on the step face in the circumference, a first projecting conductor 5, which is formed on the surface outside the said step surface and to which one end of the first inner lead is connected, though the other end of it is connected to the input/output terminal of the semiconductor chip 3 through a metallic fine line 3, and a second projecting conductor 7, which is connected through second inner lead 4b to an external lead 6 being exposed to the surface in the circumference and also projecting from the rear.
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