| 摘要 |
PURPOSE:To embody a reliable joint of high reliability with good productivity by heating a lead using a laser beam of high density under the condition wherein the lead is applied with pressure toward the electrode of a circuit board. CONSTITUTION:In connecting a lead 12 to a circuit board 1, a solder layer 13 is first formed on an electrode 11 on the circuit board 1. Then, the lead 12 is positioned at the focusing position of a laser beam 5 and a hollow tool 6 is lowered. The lead 12 is pressed with the tip of the tool 8 and a laser beam source 5 is operated. thereby focusing the laser beam 3 for irradiating the lead 12. Thereafter, the lead 12 is heated and the layer 13 is thereby fused, ensuring the jointing of the lead 12 to the electrode 11 via solder. In this case, when the laser beam 5 is increased in energy density it is possible to heat and fuse the solder layer 15 via the lead 12 in a short time. Furthermore, as the solder layer 13 is not directly heated with the laser beam 5, the solder is free from flying a round due to the rapid evaporation of flux and the joint of high reliability is obtained. |
