| 摘要 |
PURPOSE:To obtain a dense sintered compact of AlN capable of sintering simultaneously with the sintering of copper, silver, etc., and also capable of low-temp. sintering and having high thermal conductivity by adding prescribed amounts of glass powder having a central grain size one-half or less of that of an AlN powder to the AlN powder and subjecting the resulting powder mixture to compacting and then to sintering. CONSTITUTION:A glass powder having a central grain size one-half or less of the central grain size of an aluminum nitride powder is added by 10-70vol.% to the aluminum nitride powder of 0.5-50mum central grain size. Subsequently, a proper binder (e.g., polyvinyl butyral) is added to the above, and the resulting powder mixture is compacted by means of press compacting, etc. After a wiring is printed, if necessary, on the resulting green compact by using a paste of copper, silver, silver-palladium, gold, etc., the green compact is sintered in the air or in a nitrogen atmosphere at a temp. not exceeding the melting point of the material used in wiring, by which the sintered compact of aluminum nitride can be obtained. The resulting sintered compact has a thermal conductivity considerably higher than 3W/mK which is the thermal conductivity of the conventional alumina-glass substrate. |
